Die Compaction
Compared to Powder Injection Molding(PIM), the molding process and the manufacturing unit cost of Die Compaction(DP) is more competitive. However, due to the shapeable formed and residual pores after sintering, DP has a disadvantage of lower physical properties than parts made by PIM.
PMsolver, the company developed special CAE software, can analyze the die compression molding and sintering processes. PMsolver also studies the relationship between process conditions, crack formation and sintering deformation. With this technology and experience, CetaTech Inc. concentrates on developing products that are difficult to manufacture by compression molding.
The research results of our company have been recognized worldwide and published in "Modeling and Simulation of Press and Sinter Powder Metallurgy" in the ASM Handbook, Volume 22B (Metals Process Simulation), pp.323-334. In addition, the results of this study are recognized as important technologies in the field of Powder Metallurgy(PM) and the same contents were published in the ASM Handbook, Volume 7 (Powder Metallurgy), pp.179-190 of 2015
Die Compaction & Sintering(DP) Process
Design Process of DP using CAE technology
DP Process Simulation(1) using CAE technology
DP Process Simulation(2) using CAE technology
DP Process Simulation(3) using CAE technology