The CetaTech Copper-Tungsten alloy (NanoCuT) is manufactured by nano tungsten coated W-Cu composite powder (U.S. Patent 6,863,707). The advantages of NanoCuT are very uniform microstructure, higher sintered densities (98-99.9% TD) and excellent mechanical and physical properties.

 

The NanoCuT can be provided with wide range of tungsten contents (10~85 wt %). Specially, the NanoCuT can be provided with the net shape by metal injection molding (MIM) or P/M.

 

High-density tungsten-copper alloys with a tungsten content of over 90% are manufactured by infiltration process. Powder injection molding or powder metallurgy technology can be applied to produce semi-regular shape products according to user's requirements.